Global Standards for the Microelectronics Industry
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Displaying 1 - 5 of 7 documents. Show 5 results per page.
Title | Document # | Date |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |