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Title Document # Date

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

MO-248-E Jun 2006

Item 11.11-744.

Patents(): Amkor, ASAT, National Semiconductor: See Outline

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

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Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

MO-247-D May 2007

Item 11.11-767

Patents(): AIT, ASAT: See Outline

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

Free download. Registration or required.

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