Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 5 of 5 documents.
Title | Document # | Date |
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Registration - Ceramic Quad Flatpack Package (CQFP) Tray for Handling and Shipping. Item 11.5-259. |
CO-011-B | Mar 1990 |
Free download. Registration or login required. |
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Registration - Tray for Handling and Shipping of Metric Quad Flatpack (QFP) Packages. Variations AA-AE. Item 11.5-298/336. |
CO-012-C | Nov 1992 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN. |
MO-247-D | May 2007 |
Item 11.11-767 Patents(): AIT, ASAT: See Outline Free download. Registration or login required. |