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Displaying 1 - 5 of 5 documents.

Title	Document #	Date
Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446.	TO-270C	Jul 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 2, 4, and 6 Lead Screw Mount Power Package. PDFP-(C, F, G). Item 11.10-444.	TO-272-C	Oct 2007
Committee(s): JC-11.11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM:	JEP145	Feb 2003
This publication is intended as a guideline to establish procedures, consideration and common practices that will allow a manufacturer, an application entity, a system designer and other interested parties to define current capability limitations in the leads of components and power systems with semiconductor components. This is a guideline, not a standardized method, it was developed over several years to clarify questions that had been posed to committee members in their respective engineering functions. Committee(s): JC-25 Free download. Registration or login required.
Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787	MO-253-B	Feb 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.