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Displaying 1 - 3 of 3 documents.

Title	Document #	Date
Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).	DO-214-D	Apr 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
POWER AND TEMPERATURE CYCLING	JESD22-A105D	Jan 2020
The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes and simultaneously the operating biases are periodically applied and removed. It is intended to simulate worst case conditions encountered in application environments. The power and temperature cycling test is considered destructive and is only intended for device qualification. This test method applies to semiconductor devices that are subjected to temperature excursions and required to power on and off during all temperatures. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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