Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N. |
DG-4.8C | Sep 2006 |
Item 11.2-713(s) Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-219D | Apr 2024 |
Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-215E | May 2024 |
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 Free download. Registration or login required. |
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Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416 |
TO-261-C | May 2002 |
Free download. Registration or login required. |