Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e). |
DO-214-D | Apr 2003 |
Free download. Registration or login required. |
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Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423. |
MO-235-B | Feb 2003 |
Free download. Registration or login required. |
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Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416 |
TO-261-C | May 2002 |
Free download. Registration or login required. |
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Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
Free download. Registration or login required. |