Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON. |
MO-240C | Aug 2012 |
Item 11.11-860 Free download. Registration or login required. |
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Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E). |
TO-278B | Nov 2006 |
Patents(): STMicroelectronics Inc. Free download. Registration or login required. |
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Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668. |
MO-249-A | Jan 2004 |
Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439. |
DO-222A | May 2006 |
Free download. Registration or login required. |
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Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. Committee(s): JC-11 |
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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA. |
MS-034G | Jan 2017 |
Item No. 11.11-933 (S) Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311. |
CS-002-A | Mar 1993 |
Free download. Registration or login required. |