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Title	Document #	Date
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.	DG-4.19D	May 2007
Item 11.2-765(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-219D	Apr 2024
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-215E	May 2024
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416	TO-261-C	May 2002
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.	CO-033-A	Aug 1998
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.	DO-221B	Aug 2018
Item 11.10-455. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.	MO-257-B	May 2005
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), .	TO-273-B	Jul 2003
Patents(): It has been stated that U.S. Patent No. 6,476,481 (held by International Rectifier) may be required to comply with certain implementations of the package outline. Committee(s): JC-11.1, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.	MO-187-F	Sep 2010
Item 11.11-832 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.	MO-235-B	Feb 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.	MO-137E	Mar 2010
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline Package with Exposed Heat Sink.	MO-230-A	Mar 2001
Item 11.11-574 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.	MO-283-B	Jan 2008
Item 11.4-782 Patents(): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT). Committee(s): JC-11, JC-11.4, JC-65 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. H-PSIP-G.	TO-263F	Sep 2013
Item No. 10-452 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.	TO-279B	Aug 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.	MO-252D	Mar 2010
Item 11.11-830. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.	MO-247-D	May 2007
Item 11.11-767 Patents(): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.	MO-293B	Sep 2021
Item 11.10-459 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).	DO-214-D	Apr 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436	TO-277A	Jan 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431.	DO-220-B	Oct 2004
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.	MO-251-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.	MO-220-K.01	Aug 2011
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.

PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)

Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package

Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.

Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.

Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.

Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), .

Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.

Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.

Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.

Registration - Plastic Small Outline Package with Exposed Heat Sink.

Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.

Registration - Plastic Surface Mounted Header Family. H-PSIP-G.

Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.

Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.

Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.

Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).

Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

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