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Title	Document #	Date
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311.	CS-002-A	Mar 1993
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.	CO-033-A	Aug 1998
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline Package with Exposed Heat Sink.	MO-230-A	Mar 2001
Item 11.11-574 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416	TO-261-C	May 2002
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.	MO-235-B	Feb 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).	DO-214-D	Apr 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), .	TO-273-B	Jul 2003
Patents(): It has been stated that U.S. Patent No. 6,476,481 (held by International Rectifier) may be required to comply with certain implementations of the package outline. Committee(s): JC-11.1, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.	MO-249-A	Jan 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.	MO-251-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431.	DO-220-B	Oct 2004
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.	MO-257-B	May 2005
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436	TO-277A	Jan 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.	DO-222A	May 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).	TO-278B	Nov 2006
Patents(): STMicroelectronics Inc. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.	DG-4.19D	May 2007
Item 11.2-765(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.	MO-247-D	May 2007
Item 11.11-767 Patents(): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.	MO-283-B	Jan 2008
Item 11.4-782 Patents(): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT). Committee(s): JC-11, JC-11.4, JC-65 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.	TO-279B	Aug 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.	MO-291-B	Dec 2008
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.	MO-252D	Mar 2010
Item 11.11-830. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.	MO-137E	Mar 2010
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.	MO-292C	Apr 2010
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.	MO-187-F	Sep 2010
Item 11.11-832 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.

Registration - Plastic Small Outline Package with Exposed Heat Sink.

Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416

Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.

Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).

Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), .

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431.

Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.

Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436

Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).

Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.

Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD.

Registration - Plastic Surface Mounted Header Family. R-PSFM-F. Item 11.10-447.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.

Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.

Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.

Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.

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