Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package |
MO-311F | Oct 2022 |
Designator: PBGA-B#[#]_I0p65... Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501. |
CO-033-A | Aug 1998 |
|
Free download. Registration or login required. |
||
Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2. |
DO-221B | Aug 2018 |
Item 11.10-455. Free download. Registration or login required. |
||
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707. |
MO-257-B | May 2005 |
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Free download. Registration or login required. |
||
Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), . |
TO-273-B | Jul 2003 |
Patents(): It has been stated that U.S. Patent No. 6,476,481 (held by International Rectifier) may be required to comply with certain implementations of the package outline. Committee(s): JC-11.1, JC-11.10 Free download. Registration or login required. |
||
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO. |
MO-187-F | Sep 2010 |
Item 11.11-832 Free download. Registration or login required. |
||
Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423. |
MO-235-B | Feb 2003 |
|
Free download. Registration or login required. |
||
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink. |
MO-204-B | Jun 2001 |
Item 11.11-586 Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC. |
MO-137E | Mar 2010 |
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Free download. Registration or login required. |
||
Registration - Plastic Small Outline Package with Exposed Heat Sink. |
MO-230-A | Mar 2001 |
Item 11.11-574 Committee(s): JC-11.11 Free download. Registration or login required. |
||
