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Title	Document #	Date
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.	MO-247-D	May 2007
Item 11.11-767 Patents(): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.	DG-4.19D	May 2007
Item 11.2-765(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).	TO-278B	Nov 2006
Patents(): STMicroelectronics Inc. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.	DO-222A	May 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436	TO-277A	Jan 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.

Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

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