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Title	Document #	Date
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE	MS-012H	Feb 2025
Designator: PDSO-G#_I127-##... Item 11-1061 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-215E	May 2024
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-219D	Apr 2024
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.	DO-221B	Aug 2018
Item 11.10-455. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. H-PSIP-G.	TO-263F	Sep 2013
Item No. 10-452 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.	MO-220-K.01	Aug 2011
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.	MO-187-F	Sep 2010
Item 11.11-832 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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JEDEC Education Series: Memory, Mobile & Modules