Global Standards for the Microelectronics Industry
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Displaying 1 - 4 of 4 documents.
Title | Document # |
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Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON. |
MO-240C | Aug 2012 |
Item 11.11-860 Free download. Registration or login required. |
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Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP. |
MO-272-A | May 2006 |
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Free download. Registration or login required. |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink. |
MO-204-B | Jun 2001 |
Item 11.11-586 Committee(s): JC-11.11 Free download. Registration or login required. |