Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 4 of 4 documents.
| Title | Document # | Date |
|---|---|---|
LEADLESS CHIP CARRIER PINOUTS STANDARDIZED FOR LINEARS: |
JESD1 | Apr 1982 |
This standard shows how to convert existing DIP pinouts for op-amps, comparators, and D/A converters, to chip carrier packages. Committee(s): JC-41 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS: |
JESD75-2 | Jul 2001 |
This standard provides a pinout standard for 16-bit wide logic devices offered in a 56-ball areagrid array package to provide for uniformity, multiplicity of sources, elimination of confusion,ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE: |
JESD75-1 | Oct 2001 |
This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch. Committee(s): JC-40 Free download. Registration or login required. |
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Double Word Wide MOS SRAM |
SRAM3.7.8 | Apr 2007 |
Release No. 16. Item 1541.03 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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