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Title	Document #	Date
FLIP CHIP TENSILE PULL	JESD22-B109C	Mar 2021
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test. Committee(s): JC-14.1 Free download. Registration or login required.

Title

Document #

Date

FLIP CHIP TENSILE PULL

JESD22-B109C

Mar 2021

The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.

Committee(s): JC-14.1

Free download. Registration or login required.

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FLIP CHIP TENSILE PULL

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