Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 3 of 3 documents.
Title | Document # | Date |
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Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA. |
MO-302C | Aug 2016 |
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 Free download. Registration or login required. |
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Package-on-Package (PoP) and Internal Stacked Module (ISM) |
MCP3.12.2 | Jan 2012 |
Release No. 22. Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Design Requirements - Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP). |
DR-4.22C.02 | Mar 2011 |
Item 11.2-839(R) Free download. Registration or login required. |