Global Standards for the Microelectronics Industry
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Displaying 1 - 5 of 9 documents. Show 5 results per page.
Title |
Document # | Date |
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DELPHI COMPACT THERMAL MODEL GUIDELINE |
JESD15-4 | Oct 2008 |
This guideline specifies the definition and lists acceptable approaches for constructing a compact thermal model (CTM) based on the DELPHI methodology. The purpose of this document is twofold. First, it aims to provide clear guidance to those seeking to create DELPHI compact models of packages. Second, it aims to provide users with an understanding of the methodology by which they are created and validated, and the issues associated with their use. Committee(s): JC-15 Free download. Registration or login required. |
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Power Cycling |
JESD22-A122B | Nov 2023 |
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. Free download. Registration or login required. |
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Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM |
MO-268E | Mar 2014 |
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic Small Outline Package with Exposed Heat Sink. |
MO-230-A | Mar 2001 |
Item 11.11-574 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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