Standards & Documents Search

Displaying 6 - 9 of 9 documents. Show 5 results per page.

Title	Document #	Date
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA. Status: Rescinded March 2018	MO-273C	Mar 2011
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page
Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM	MO-268E	Mar 2014
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Power Cycling	JESD22-A122B	Nov 2023
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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