Global Standards for the Microelectronics Industry
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Title |
Document # | Date |
|---|---|---|
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES |
JESD51-31 | Jul 2008 |
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-15 Free download. Registration or login required. |
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