Global Standards for the Microelectronics Industry
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| Title | Document # |
Date |
|---|---|---|
PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE |
JESD22-B112B | Aug 2018 |
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation. Committee(s): JC-14.1 Free download. Registration or login required. |
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