Global Standards for the Microelectronics Industry
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Displaying 1 - 9 of 9 documents. Show 5 results per page.
Title | Document # | Date |
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Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657. |
MO-251-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707. |
MO-257-B | May 2005 |
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Free download. Registration or login required. |
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Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN. |
MO-267-B | Feb 2006 |
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N. |
DG-4.8C | Sep 2006 |
Item 11.2-713(s) Free download. Registration or login required. |
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Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN. |
MO-296B | Jan 2012 |
Item 11.11-849 Free download. Registration or login required. |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON). |
DG-4.20F | Sep 2016 |
Item 11.2-820(S) Free download. Registration or login required. |