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Title	Document #	Date
BOND WIRE MODELING STANDARD:	JESD59	Jun 1997
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-15.2 Free download. Registration or login required.

Title

Document #

Date

BOND WIRE MODELING STANDARD:

JESD59

Jun 1997

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-15.2

Free download. Registration or login required.

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