Standards & Documents Search

Displaying 1 - 1 of 1 documents.

Title Document # Date

Mobile Platform Memory Module Thermal Sensor Component Specification

 MODULE4.7 May 2022

Release No. 16.

This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents

(Release 15, Item 1640.07)

Committee(s): JC-42.4

JESD21-C Solid State Memory Documents Main Page

Free download. Registration or required.

Search by Keyword or Document Number

or Reset