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Title	Document #	Date
Compression Attached Memory Module (CAMM2) Common Standard	JESD318 Ver. 1.02	Nov 2023
This standard defines the electrical and mechanical requirements for Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s). Committee(s): JC-45 Free download. Registration or login required.
Power Cycling	JESD22-A122B	Nov 2023
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature	JESD22-B112C	Nov 2023
This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
IC LATCH-UP TEST	JESD78F.02	Nov 2023
This standard establishes the procedure for testing, evaluation and classification of devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined latch-up stress. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Test Method for Total Ionizing Dose (TID) from X-ray Exposure in Terrestrial Applications	JESD22-B121	Nov 2023
This test method covers X-ray imaging for terrestrial applications on packaged devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Zoned Storage for UFS	JESD220-5	Nov 2023
The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification. Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476 Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension	JESD220-4 Version 1.01	Nov 2023
This standard specifies the extension specification of the UFS electrical interface and the memory device. PLEASE NOTE: Revision and renumbering of JESD231 Version 1.0, August 2022 Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30L	Nov 2023
This standard establishes requirements for the generation of electronic-device package designators. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices	JEP198	Nov 2023
This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches. Committee(s): JC-70, JC-70.1 Free download. Registration or login required.
Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices	JEP197	Nov 2023
This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces	JEP196	Nov 2023
This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema	JEP181_Schema_R2p0	Nov 2023
In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”. Committee(s): JC-15 Free download. Registration or login required.
ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements	JEP181A	Nov 2023
This publication establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. Committee(s): JC-15 Free download. Registration or login required.
JEDEC Manual of Organization and Procedure	JM21V	Nov 2023
This Manual sets forth the mission and requirements of JEDEC as an independent incorporated Association governed by a Board of Directors. Committee(s): JC-BOD Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v4-0-0	Nov 2023
This download includes all files under the parent schema JEP30-10v4-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-1 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v3-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v4-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-1 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v3-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM	DR-4.5O	Nov 2023
BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM Item 2-1038 Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Registration - PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)	SO-032B	Nov 2023
Designator: SO-032B_PDUtBXC-H644_I1p0-R17p15x78p0Z1p05 Item: 14-222 Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Compression Attached Memory Module (CAMM2) Common Standard

Power Cycling

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

IC LATCH-UP TEST

Test Method for Total Ionizing Dose (TID) from X-ray Exposure in Terrestrial Applications

Zoned Storage for UFS

Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension

DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES

Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices

Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements

JEDEC Manual of Organization and Procedure

PART MODEL SCHEMAS

Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Guidelines for Electronic-Device Packages – XML Requirements

Registration - PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)

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