Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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TRANSIENT DUAL INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW THROUGH A SINGLE PATH |
JESD51-14 | Nov 2010 |
This document specifies a test method (referred to herein as “Transient Dual Interface Measurement”) to determine the conductive thermal resistance “Junction-to-Case” RθJC (θJC) of semiconductor devices with a heat flow through a single path, i.e., semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink. TDIM Master Software: TDIM-Master-2011-04-06.zip
Committee(s): JC-15 Free download. Registration or login required. |
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TRANSIENT VOLTAGE SUPPRESSOR STANDARD FOR THYRISTOR SURGE PROTECTIVE DEVICE:Status: ReaffirmedNovember 2006 |
JESD66 | Nov 1999 |
This standard is applicable to Thyristor Surge Protective Devices. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. The intended users of this standard are those interested in Thyristor Surge Protective Device characterization and rating verification. These devices are used primarily by the telecommunications industry to protect circuits from harmful overvoltages. The Thyristor Surge Protective Device (TSPD) is a semiconductor device that is finding widespread application in the telecommunication industry. The intent of this stand is to provide information on test methods that will reduce the possibility of disagreement and misunderstanding between TSPD vendors and users, and facilitate the determination of device interchangeability. Committee(s): JC-22.5 Free download. Registration or login required. |
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TRANSISTOR, GALLIUM ARSENIDE POWER FET, GENERIC SPECIFICATION: |
JES2 | Jul 1992 |
Establishes guideline requirements and quality assurance provisions for gallium arsenide power field-effect transistors (FETs, also know as MESFETs) designed for use in high-reliability space application such as spacecraft communications transmitters. Identifies the electrical parameters, wafer acceptance tests, screening tests, qualification tests, and lot acceptance tests pertinent to power GaAs FETs. Applicable to packaged and chip-carrier parts; portions may not be applicable to unpackaged and unmounted chips. Committee(s): JC-14.7 Free download. Registration or login required. |
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TS3000 Standalone Thermal Sensor Component |
SPD4.1.5 | Nov 2009 |
Release No. 19A, Item 1640.11 Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TS511X, TS521X Serial Bus Thermal Sensor Device Standard |
JESD302-1A | Aug 2023 |
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document. Committee(s): JC-40.1 Free download. Registration or login required. |
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TSE2002 Serial Presence Detect with Thermal Sensor |
PRN09-NV2 | Jul 2009 |
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release of the appropriate JEDEC Standard. Item 1756.00A Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Two Byte Modules Cards |
MODULE4.3 | Jun 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TWO-RESISTOR COMPACT THERMAL MODEL GUIDELINE |
JESD15-3 | Jul 2008 |
This document specifies the definition and construction of a two-resistor compact thermal model (CTM) from the JEDEC junction-to-case and junction-to-board thermal metrics. The guidance provided in this document only applies to thermal metrics defined in JEDEC standards JESD51-8 and JESD51-12. The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature. Committee(s): JC-15 Free download. Registration or login required. |
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TYPE DESIGNATION SYSTEM FOR MICROELECTRONIC DEVICESStatus: Rescinded<p>September 1993</p> |
EIA428-A | Jan 1988 |
Committee(s): JC-10 |
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UFS Card Socket Performance Standard |
PS-004A | Jul 2020 |
For UFS Card 6 Gb/s Item 11.14-195S Committee(s): JC-11.14 Free download. Registration or login required. |
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UNDERSTANDING ELECTRICAL OVERSTRESS - EOSStatus: Reaffirmed May 2022 |
JEP174 | Sep 2016 |
This purpose of this white paper will be to introduce a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. Committee(s): JC-14.3 Free download. Registration or login required. |
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UNIFIED WIDE POWER SUPPLY VOLTAGE RANGE CMOS DC INTERFACE STANDARD FOR NON-TERMINATED DIGITAL INTEGRATED CIRCUITS |
JESD8-23 | Oct 2009 |
This standard defines DC interface parameters and test conditions for a family of non-terminated CMOS digital circuits intended for use over a wide power supply voltage range. The standard bridges a number of existing JEDEC standards in the JESD8-x family to facilitate applications that operate over an ultra-wide power supply voltage range in order to achieve lower power dissipation or higher performance. Committee(s): JC-16 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION, Version 3.0 |
JESD220-2B | Nov 2020 |
This standard specifies the characteristics of the UFS card electrical interface and the memory device. This document defines the added/modified features in UFS card compared to embedded UFS device. For other common features JESD220, UFS, will be referenced. Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-64.1 Available for purchase: $76.00 Add to Cart Paying JEDEC Members may login for free access. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension |
JESD220-4 Version 1.01 | Nov 2023 |
This standard specifies the extension specification of the UFS electrical interface and the memory device. PLEASE NOTE: Revision and renumbering of JESD231 Version 1.0, August 2022 Free download. Registration or login required. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension, Version 1.0Status: Superseded |
JESD231 | Aug 2022 |
JESD231 was superseded by the renumbered JESD220-4 Version 1.01. Committee(s): JC-64.1 |
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UNIVERSAL FLASH STORAGE (UFS) HOST PERFORMANCE BOOSTER (HPB) EXTENSION, VERSION 2.0 |
JESD220-3A | Sep 2020 |
This standard specifies the extension specification of the UFS electrical interface and the memory device. This document describes the extended feature, called Host Performance Booster (HPB), in UFS specification. It also provides some details in how to utilize the HPB for realizing high performance in UFS devices. Committee item 138.34 Patents(): WD: 9,323,657 Committee(s): JC-64.1 Available for purchase: $80.00 Add to Cart Paying JEDEC Members may login for free access. |
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UNIVERSAL FLASH STORAGE (UFS) SECURITY EXTENSIONItem 112.99 |
JESD225 | Nov 2016 |
This document provides a comprehensive definition of the UFS security requirements for implementation of IEEE 1667 and TCG Opal security functionality. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. Committee(s): JC-64.1 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) TEST |
JESD224A | Jul 2017 |
The primary objective of this test standard is to specify the test cases for UFS device protocol conformance testing. This test standard provides test cases for checking the functions defined in the following target standard: JESD220. Universal Flash Storage (UFS) Standard version 1.1A. MIPI M-PHY and MIPI UniPro test cases are not in the scope of this document. Item 400.36 Committee(s): JC-64.5 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) UNIFIED MEMORY EXTENSION, Version 1.1 |
JESD220-1A | Mar 2016 |
This UFS Unified Memory Support Extension standard is an extension to the UFS standard, JESD220, This standard defines a managed storage device. UFS devices are designed to offer a high performance with low power consumption. The UFS device contains features that support both high throughput for large data transfers and performance for small random data accesses. This standard describes the requirements to implement unified memory functionality in an UFS device. Unified Memory Support is not mandatory but optional. Item 133.11 Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Free download. Registration or login required. |
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Universal Flash Storage (UFS), Version 2.1Status: Superseded August 2020 |
JESD220C-2.1 | Mar 2016 |
This document has been superseded by JESD220C-2.2, August 2020, and is provided here for reference purposes only. This standard specifies the characteristics of the UFS electrical interface and the memory device. Such characteristics include (among others) low power consumption, high data throughput, low electromagnetic interference and optimization for mass memory subsystem efficiency. The UFS electrical interface is based on an advanced differential interface by MIPI M-PHY specification which together with the MIPI UniPro specification forms the interconnect of the UFS interface. The architectural model is referencing the INCITS T10 (SCSI) SAM standard and the command protocol is based on INCITS T10 (SCSI) SPC and SBC standards. Item 133.00B Committee(s): JC-64.1 Free download. Registration or login required. |
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