Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235. |
MO-062-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-027-A. Item 11.11-404S. |
MO-061-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). |
MO-058-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 |
MO-057-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207. |
MO-055-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133. |
MO-054-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular). |
MO-052-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205. |
MO-048-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242. |
MO-047-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147. |
MO-046-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Single-In-Line Power Module. Item 11.3-128. |
MO-045-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. |
MO-043-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101. |
MO-042-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power Module. Recission of Variation AB. |
MO-040-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. |
MO-039-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing. |
MO-038-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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