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This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests.

Committee(s): JC-13, JC-13.5

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This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.

Committee(s): JC-14, JC-14.3

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This publication includes addenda from 1976 to August 1986. The purpose of this list is to determine release numbers (file numbers) for JEDEC Type Designations. (See page 6 for more information.)

Committee(s): JCJEDC

This document provides an industry standard method for characterization and monitoring thermal stress test oven temperatures. The procedures described in this document should be used to insure thermal stress test conditions are being achieved and maintained during various test procedures.

Committee(s): JC-14, JC-14.1

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This document describes a constant temperature (isothermal) aging method for testing aluminum (Al) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding. This method is valid for metallization/dielectric systems in which the dielectric is deposited onto the metallization at a temperature considerably above the intended use temperature, and above or equal to the deposition temperature of the metal. Although this is a wafer test, it is not a fast (less than 5 minutes per probe) test. It is intended to be used for lifetime prediction and failure analysis, not for production Go-NoGo lot checking.

Committee(s): JC-14.2

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This publication establishes guidelines and provides examples by which customers can measure their suppliers based on mutually agreed upon objective criteria.

Committee(s): JC-14, JC-14.4

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Certain PSMC (Plastic Surface-mount Components) are subject to permanent damage due to moisture-induced failures encountered during high-temperature surface-mount processing unless appropriate precautions are observed. The purpose of this publication is to provide a distinctive symbol and labels to be used to identify those devices that require special packing and handling precautions.

Committee(s): JC-14.1

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This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing.

Committee(s): JC-13, JC-13.5

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The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.

Committee(s): JC-14, JC-14.1

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