Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
| Title | Document # | Date |
|---|---|---|
IPC/JEDEC-9703: MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITYStatus: Reaffirmed May 2014, May 2019 |
JS9703 | Mar 2009 |
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. Committee(s): JC-14.1 Free download. Registration or login required. |
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MECHANICAL SHOCKStatus: Supersededby JEDEC JESD22-B110B, July 2013 |
JESD22-B104C | Nov 2004 |
This test is intended to determine the suitability of component parts for use in electronic equipment that may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. It is normally applicable to cavity-type packages. |
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