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PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

 JESD22-B112B Aug 2018

The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

Committee(s): JC-14.1

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Design Requirements - Ball Grid Array (BGA)Package Measuring and Methodology.

 DG-4.17C Jul 2008

Item 11.2-791(S)

Committee(s): JC-11, JC-11.11

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