Global Standards for the Microelectronics Industry
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Title | Document # |
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Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink. |
MO-204-B | Jun 2001 |
Item 11.11-586 Committee(s): JC-11.11 Free download. Registration or login required. |