Standards & Documents Search

Displaying 1 - 11 of 11 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Addition of numerous N4 body sizes to variations AE and AF of Low Profile Matrix Tray for Handling and Shipping Thin Grid Array Devices Registration. Item 11.5-634.	CO-034-D	Feb 2003
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS:	JESD75	Nov 1999
The purpose of this standard is to provide a pinout standard for dual-die 32-bit logic devices offered in a 96- and 144-ball grid array package for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease use. This standard defines device output for 32-bit wide buffer, driver and transceiver functions. This pinout specifically applies to the conversion of DIP-packaged 16-bit logic devices to LFBGA-packaged dual-die 32-bit logic devices. Committee(s): JC-40 Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Addition of numerous N4 body sizes to variations AE and AF of Low Profile Matrix Tray for Handling and Shipping Thin Grid Array Devices Registration. Item 11.5-634.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS:

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: