Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
Title | Document # | Date |
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REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590. |
MO-231-A | Aug 2001 |
Free download. Registration or login required. |
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Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078 |
MO-206-E | Jan 2006 |
Committee(s): JC-11.14 Free download. Registration or login required. |