Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
Title | Document # | Date |
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Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch |
MO-303B | Mar 2012 |
Item No. 11.11-857 Free download. Registration or login required. |
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Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA) |
DG-4.25B | Aug 2016 |
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-896(S) Free download. Registration or login required. |