Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 2 of 2 documents.
Title | Document # | Date |
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Package-on-Package (PoP) and Internal Stacked Module (ISM) |
MCP3.12.2 | Jan 2012 |
Release No. 22. Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Design Requirements - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM). |
DG-4.21A | Feb 2007 |
Item 11.2-699(S) Committee(s): JC-11 Free download. Registration or login required. |