Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 1 of 1 documents.
Title | Document # | Date |
---|---|---|
High Bandwidth Memory (HBM3) DRAM |
JESD238B.01 | Apr 2025 |
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |