Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311. |
CS-002-A | Mar 1993 |
Free download. Registration or login required. |
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Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519. |
CS-005-B | Nov 1998 |
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Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S. |
CS-008-A | Mar 1996 |
Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Shipping and Handling of Ball Grid Packages. Includes Change to Note 18. Item 11.5-633 |
CO-029-H | Sep 2002 |
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HANDLING AND INSTALLATION OF POWER SEMICONDUCTORS IN DISC TYPE PACKAGES: Included in JESD282 and EIA397.Status: RescindedJun-92 |
TENTSTD11 | Jan 1973 |
Committee(s): JC-22.2 |
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Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature. |
DG-4.10D | Oct 2002 |
Item 11.2-615s Free download. Registration or login required. |
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Standard - Thin Matrix Tray for Handling and Shipping PLCC Packages. Variations AA-AL. Item 11.5-312. |
CS-003-B | Apr 1993 |
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JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES |
J-STD-033D | Apr 2018 |
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Free download. Registration or login required. |