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CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE

Status: Reaffirmed February 2023 		JP002 Mar 2006

This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided.

Committee(s): JC-14, JC-14.1

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MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES

Status: Reaffirmed May 2014, September 2019 		JESD22-A121A Jul 2008

The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

Committee(s): JC-14, JC-14.1

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