Standards & Documents Search

Displaying 1 - 5 of 5 documents.

Title	Document #	Date
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA	MO-158-D	Apr 2002
Patents(): IBM: 4,914,814 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.	MO-222-B.01	Dec 2010
Item 11.11-803, 11.11-842E Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM).	DG-4.21A	Feb 2007
Item 11.2-699(S) Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S) Status: SupersededAugust 2016 (11.2-924)	SPP-020A	Jul 2003
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.