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Title	Document #	Date
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Title

Document #

Date

MO-248-E

Jun 2006

Item 11.11-744.

Patents(): Amkor, ASAT, National Semiconductor: See Outline

Committee(s): JC-11, JC-11.11

Free download. Registration or login required.

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