Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 5 of 5 documents.
| Title | Document # | Date |
|---|---|---|
Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), . |
TO-273-B | Jul 2003 |
Patents(): It has been stated that U.S. Patent No. 6,476,481 (held by International Rectifier) may be required to comply with certain implementations of the package outline. Committee(s): JC-11.1, JC-11.10 Free download. Registration or login required. |
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Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G. |
TO-252F | Feb 2017 |
Item 11.10-456 Committee(s): JC-11.10 Free download. Registration or login required. |
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Registration - The general update and change of lead dimensions for flange mounted family, insertion mount (peripheral terminals). R-PSIP-F3. Item 11.10-417 |
TO-251-D | Jun 2002 |
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Free download. Registration or login required. |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16. |
MO-138-A | Jun 1993 |
Item 11.10-310 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F |
TO-281A | Nov 2011 |
Item 11.11-854 Free download. Registration or login required. |
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