Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON |
MO-229F | Aug 2012 |
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA. |
MO-195-D | May 2006 |
Item 11.11-704 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA. |
MO-222-B.01 | Dec 2010 |
Item 11.11-803, 11.11-842E Committee(s): JC-11 Free download. Registration or login required. |