Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA. |
MO-222-B.01 | Dec 2010 |
Item 11.11-803, 11.11-842E A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
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