Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA. |
MO-270-B | Jun 2008 |
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA. |
MO-219-G | Jan 2007 |
Item 11.11-763 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752. |
MO-205-G | Jul 2006 |
Free download. Registration or login required. |