Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752. |
MO-205-G | Jul 2006 |
Free download. Registration or login required. |
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Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |