Global Standards for the Microelectronics Industry
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Title | Document # |
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Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA. |
MO-270-B | Jun 2008 |
Item 11.11-790 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |