Global Standards for the Microelectronics Industry
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Displaying 1 - 4 of 4 documents.
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Document # | Date |
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Registration - 240 Pin FBDIMM 1.00 mm Contact Centers, Press Fit Socket Outline. SKT. Item 11.14-113 |
SO-013A | Sep 2007 |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-282-A | Jan 2007 |
Item 11.14-099 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers. |
MO-256-F | Jun 2007 |
Item 11.14-108 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 Free download. Registration or login required. |
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STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S) |
GS-004A | Oct 2006 |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |