Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 1 of 1 documents.
SOLDER BALL PULLStatus: Reaffirmed September 2021
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document. This is a minor editorial revision to JESD22-A115A.
Free download. Registration or login required.