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Title	Document #	Date
Multichip Packages (MCP) and Discrete e•MMC, e•2MMC, and UFS Release Number: 32	MCP3.12.1	Mar 2023
Item 140.07B. This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution. Committee(s): JC-64.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
UNIVERSAL FLASH STORAGE (UFS), Version 3.1	JESD220E	Jan 2020
This document has been superseded by JESD220F, August 2022, however is available for reference only. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Available for purchase: $355.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
EMBEDDED MULTI-MEDIA CARD (e•MMC), ELECTRICAL STANDARD (5.1)	JESD84-B51A	Jan 2019
This document provides a comprehensive definition of the e•MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. Item 67.14. This document replaces all past versions, however links to the replaced versions are provided here for reference only: JESD84-B51, February 2015; JESD84-B50.1, July 2014 (Editorial revision of JESD84-B50); JESD84-B50, September 2013 (Revision of JESD84-B451); JESD84-B451, June 2012 (Revision of JESD84-B45, June 2011) Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64 Available for purchase: $327.00 Add to Cart Paying JEDEC Members may login for free access.
EMBEDDED MULTIMEDIACARD(e•MMC) e•MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports, Security Enhancement, Background Operation and High Priority Interrupt (MMCA, 4.41)	JESD84-A441	Mar 2010
The purpose of this standard is the definition of the MMC/e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. The standard also defines a tool box (a set of macro functions and algorithms) that contributes to reducing design-in costs. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Free download. Registration or login required.
EMBEDDED MULTIMEDIACARD (e·MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL	JESD84-C44	Jul 2009
JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it (e·MMC). In addition to the packaging differences, (e·MMC) devices use a reduced voltage interface. These specifications are detailed in the JEDEC Standard for Embedded MultiMediaCard e•MMC/Card Product Standard, JESD84-Axx. The purpose of the standard is the mechanical definition of the e•MMC. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64 Free download. Registration or login required.

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