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This document provides a definition of the Embedded MultiMediaCard product, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in costs.

Committee(s): JC-64

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This document is a complete specification for embedded memory devices and removable memory cards using the MMC interface version 4.3. New features developed through the Electrical Joint Task Group include: Sleep mode, Boot mode and Reliable Write.

Committee(s): JC-64, JC-64.2

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JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it (e·MMC). In addition to the packaging differences, (e·MMC) devices use a reduced voltage interface. These specifications are detailed in the JEDEC Standard for Embedded MultiMediaCard e•MMC/Card Product Standard, JESD84-Axx. The purpose of the standard is the mechanical definition of the e•MMC.

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-64

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This document provides a comprehensive definition of the e•MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. Item 67.14.

This document replaces all past versions, however links to the replaced versions are provided here for reference only: JESD84-B51, February 2015; JESD84-B50.1, July 2014 (Editorial revision of JESD84-B50); JESD84-B50, September 2013 (Revision of JESD84-B451); JESD84-B451, June 2012 (Revision of JESD84-B45, June 2011)

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-64

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Item 142.12

This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution.

Committee(s): JC-64.2

JESD21-C Solid State Memory Documents Main Page

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